Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of detecting defects in semiconductor package leads

Method of detecting defects in semiconductor package leads

US Patent 5452368 · Granted Sep 19, 1995

Estimated economic value: $11,000,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for visually inspecting an object2002
Method and apparatus for visually inspecting an object2000
Method of detecting defects in semiconductor package leads2000
Wafer prober having an emissive display inspection system and method of use1999
Apparatus and method for acquiring multiple images1999
Lead coplanarity inspection apparatus and method thereof1996
Bond inspection technique for a semiconductor chip1993
Lead inspection method using a plane of light for producing reflected lead image1993
Method for detection of defects lacking distinct edges1993
Thermal delay non-destructive bond integrity inspection1993
Automatic package inspection method1992
Method for automatic semiconductor wafer inspection1992