Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Precision high rate electroplating cell and method

Precision high rate electroplating cell and method

US Patent 5421987 · Granted Jun 6, 1995

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Metallic interconnects products2018
Methods for activating openings for jets electroplating2018
Seed layers for metallic interconnects2017
High speed electroplating metallic conductors2016
Continuous process for manufacturing freely flowing solid acidic P/K fertilizer2016
Electroplated metallic conductors2016
Continuous process for manufacturing a neutral granular P/K fertilizer2015
Method and apparatus to achieve lossless call in view of a temporary reception i2015
Enhanced electrochemical deposition filling2014
Floating semiconductor foils2013
Seed layers for metallic interconnects and products2013
Floating Si and/or Ge foils2013