Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heat transfer module for ultra high density and silicon on silicon packaging applications

Heat transfer module for ultra high density and silicon on silicon packaging applications

US Patent 5402004 · Granted Mar 28, 1995

Estimated economic value: $4,968,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit packaging2002
Method of cooling an electronic power module using a high performance heat excha2002
Power electronic module packaging2002
Power electronic module packaging2001
High performance heat exchanger and method2001
Integrated circuit packaging method and the package1998
Constraining core for surface mount technology1998
Constraining core for surface mount technology1993
Ceramic based substrate for electronic circuit system modules1990
Module for packaging semiconductor integrated circuit chips on a base substrate1989
Method of partitioning, testing and diagnosing a VLSI multichip package and asso1989
High performance integrated circuit packaging structure1989