Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hier archical pitchmaking compaction method and system for integrated circuit design

Hier archical pitchmaking compaction method and system for integrated circuit design

US Patent 5381343 · Granted Jan 10, 1995

Estimated economic value: $8,919,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optical signal receiver comprising a multi-tap pixel2025
Image sensor with actively cooled sensor array2024
Repeated nondestructive photodetector readout assessments2024
Imaging sensor with near-infrared absorber2024
Illumination for zoned time-of-flight imaging2023
Depth image sensor with always-depleted photodiodes2023
Selective power efficient three-dimensional imaging2023
Low power operation of differential image sensor pixels2021
Tunable spectral illuminator for camera2021
Camera comprising an infrared illuminator and a liquid crystal optical filter sw2021
Tunable spectral illuminator for camera2021
Depth and multi-spectral camera2021