Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › De-coupling capacitor on the top of the silicon die by eutectic flip bonding

De-coupling capacitor on the top of the silicon die by eutectic flip bonding

US Patent 5369545 · Granted Nov 29, 1994

Estimated economic value: $18,020,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Ultra-thin, hyper-density semiconductor packages2025
Moisture seal coating of hybrid bonded stacked die package assembly2025
Nested glass packaging architecture for hybrid electrical and optical communicat2025
Microelectronic structures including bridges2025
Edge-aligned template structure for integrated circuit packages2025
Ultra-thin, hyper-density semiconductor packages2025
Stripped redistrubution-layer fabrication for package-top embedded multi-die int2025
Interconnect architecture with silicon interposer and EMIB2025
Inorganic fill material for stacked die assembly2025
Substrateless double-sided embedded multi-die interconnect bridge2025