Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Two piece assembly for the selection of pinouts and bond options on a semiconductor device

Two piece assembly for the selection of pinouts and bond options on a semiconductor device

US Patent 5360992 · Granted Nov 1, 1994

Estimated economic value: $10,111,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor ICF target processing2022
Controlled variable thickness film deposition on a non-flat substrate for high v2022
Dual resistance heater for phase change memory devices2019
Dual resistive-material regions for phase change memory devices2019
Spray foam splint2019
Immunity of phase change material to disturb in the amorphous phase2017
Spray foam splint2016
Immunity of phase change material to disturb in the amorphous phase2016
Immunity of phase change material to disturb in the amorphous phase2015
Memory device with low reset current2015
Dual resistance heater for phase change devices and manufacturing method thereof2015
Wall corner panel with simulated stacked stone2015