Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Via hole punch

Via hole punch

US Patent 5303618 · Granted Apr 19, 1994

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit tester having a fail-safe mechanism for moving IC-chips2003
Process for recycling a substrate from an integrated circuit package2001
Method of casting I/O columns on an electronic component with a high yield2000
Method of forming I/O columns with open ends that are free of crater-like voids1999
Vibrating template method of placing solder balls on the I/O pads of an integrat1998
Pin block method of dispensing solder flux onto the I/O pads of an integrated ci1998
Electromechanical assembly having a lid which protects IC chips and holds contac1998
Heat transfer module incorporating liquid metal squeezed from a compliant body1996
Heat transfer sub-assembly incorporating liquid metal surrounded by a seal ring1996
Method of manufacturing I/O terminals on I/O pads1995
Method of forming holes in unfired ceramic layers of integrated circuit packages1992
Low stress multichip module1991