Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Reduced stress plastic package

Reduced stress plastic package

US Patent 5278446 · Granted Jan 11, 1994

Estimated economic value: $10,160,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fully molded semiconductor structure with face mounted passives and method of ma2025
Quad flat no-lead (QFN) package with tie bars and direct contact interconnect bu2025
Semiconductor assembly comprising a 3D block and method of making the same2025
Fully molded semiconductor structure with through silicon via (TSV) vertical int2025
Embedded component interposer or substrate comprising displacement compensation 2025
Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages2025
Fully molded bridge interposer and method of making the same2025
Method of making a fan-out semiconductor assembly with an intermediate carrier2025
Unit specific variable or adaptive metal fill and system and method for the same2025
Fully molded structure with multi-height components comprising backside conducti2025
Stackable fully molded semiconductor structure with vertical interconnects2025
Hinge assembly for eyewear2025