Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Copper electroplating solutions and processes

Copper electroplating solutions and processes

US Patent 5252196 · Granted Oct 12, 1993

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Carbon-based direct plating process2021
Solution and process for improving the solderability of a metal surface2012
Solution and process for improving the solderability of a metal surface2010
Method and composition for selectively stripping nickel from a substrate2009
Composition and method for preparing chemically-resistant roughened copper surfa2009
Bath analysis2008
Method for roughening copper surfaces for bonding to substrates2008
Additives to stop copper attack by alkaline etching agents such as ammonia and m2007
Method for roughening copper surfaces for bonding to substrates2006
Composition and method for preparing chemically-resistant roughened copper surfa2006
Composition and method for preparing chemically-resistant roughened copper surfa2005
Plating bath and method for depositing a metal layer on a substrate2005