Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10986738 | Carbon-based direct plating process | James Martin, Jason J. Carver | 2021-04-20 |
| 8110252 | Solution and process for improving the solderability of a metal surface | — | 2012-02-07 |
| 7767009 | Solution and process for improving the solderability of a metal surface | — | 2010-08-03 |
| 7591956 | Method and composition for selectively stripping nickel from a substrate | Joseph Stanton Bowers, Jr. | 2009-09-22 |
| 7563315 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | Joseph Stanton Bowers, Jr., Benjamin Todd Carroll, Alvin A. Kucera | 2009-07-21 |
| 7351353 | Method for roughening copper surfaces for bonding to substrates | Hector Gonzalez, Al Kucera, Mike Schanhaar | 2008-04-01 |
| 7211204 | Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA) | Beth Ann LaFayette, Thao Pham | 2007-05-01 |
| 7153445 | Method for roughening copper surfaces for bonding to substrates | Hector Gonzalez, Al Kucera, Mike Schanhaar | 2006-12-26 |
| 7108795 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | Joseph Stanton Bowers, Jr., Benjamin Todd Carroll, Alvin A. Kucera | 2006-09-19 |
| 6946027 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | Joseph Stanton Bowers, Jr., Benjamin Todd Carroll, Alvin A. Kucera | 2005-09-20 |
| 6716281 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | Joseph Stanton Bowers, Jr., Benjamin Todd Carroll, Alvin A. Kucera | 2004-04-06 |
| 6623787 | Method to improve the stability of dispersions of carbon | Joseph Stanton Bowers, Jr. | 2003-09-23 |
| 5395652 | Plating catalyst formed from noble metal ions and bromide ions | Gordon Fisher, Wade Sonnenberg | 1995-03-07 |
| 5252196 | Copper electroplating solutions and processes | Wade Sonnenberg, Gordon Fisher, Patrick J. Houle | 1993-10-12 |
| 5223118 | Method for analyzing organic additives in an electroplating bath | Wade Sonnenberg, Patrick J. Houle, Gordon Fisher | 1993-06-29 |
| 5068013 | Electroplating composition and process | Gordon C. Fischer, Wade Sonnenberg | 1991-11-26 |
| 5051154 | Additive for acid-copper electroplating baths to increase throwing power | Gordon Fisher, Wade Sonnenberg, Edward J. Cerwonka, Stewart Fisher | 1991-09-24 |
| 5004525 | Copper electroplating composition | Gordon Fisher, Wade Sonnenberg | 1991-04-02 |
| 4932518 | Method and apparatus for determining throwing power of an electroplating solution | Gordon Fisher, Wade Sonnenberg | 1990-06-12 |
| 4897165 | Electroplating composition and process for plating through holes in printed circuit boards | Gordon Fisher, Wade Sonnenberg | 1990-01-30 |