Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High density interconnect apparatus

High density interconnect apparatus

US Patent 5167511 · Granted Dec 1, 1992

Estimated economic value: $6,588,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Inflation device with toggle-locking trigger2024
System and method of interfacing multiple platforms to generate a customized gra2022
High-pressure syringe with pressure reduction2021
Method for revitalizing and increasing lithium ion battery capacity2016
Method to estimate battery open-circuit voltage based on transient resistive eff2015
Rack mounted electronics having connectors with heat cooling fingers2015
Relaxed memory consistency model2012
Method to minimize CD etch bias2012
Methods for incorporating a drug into an elastomeric medical device2011
Scanning system for lidar2011
Catheter having a detachable tip2011
Method and apparatus for reducing aspect ratio dependent etching in time divisio2011