Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 5211565 | High density interconnect apparatus | Nicholas J. Krajewski, David Johnson, David R. Kiefer, Kent T. McDaniel, William T. Moore +3 more | 1993-05-18 | $3,234,000 |
| 5167511 | High density interconnect apparatus | Nicholas J. Krajewski, David Johnson, David R. Kiefer, Kent T. McDaniel, William T. Moore +3 more | 1992-12-01 | $6,588,000 |
| 4637542 | Process for soldering and desoldering apertured leadless packages | Jeffrey M. Borning | 1987-01-20 | |
| 4518110 | Device for soldering/desoldering apertured lendless packages | Jeffrey M. Borning | 1985-05-21 |