Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Grain boundary junction devices using high T.sub.c superconductors

Grain boundary junction devices using high T.sub.c superconductors

US Patent 5162298 · Granted Nov 10, 1992

Estimated economic value: $8,753,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Decoupling capacitor inside gate cut trench2025
Nanosheet transistor devices with different active channel widths2025
Magnetic-field free, nonreciprocal, solid state quantum device using quantum wav2025
Decoupling capacitor inside gate cut trench2024
Ferroelectric and paraelectric stack capacitors2024
Multilayer dielectric for metal-insulator-metal capacitor2024
Non-reciprocal device comprising asymmetric phase transport of waves2023
Phase-change memory device with reduced programming voltage2023
Nonreciprocal quantum device using quantum wave collapse, interference and selec2023
Resistive switching memory cell2022
Resistive switching memory cell2022
Resistance drift mitigation in non-volatile memory cell2022