Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package having improved sealing at the aluminum nitride substrate/low melting point glass interface

Semiconductor device package having improved sealing at the aluminum nitride substrate/low melting point glass interface

US Patent 5159432 · Granted Oct 27, 1992

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Remote maintenance apparatus, terminal connected to the apparatus and computer r2008
Control valve abnormality detection method and apparatus1998
Stick-slip detection method and apparatus1998
Substrate for semiconductor apparatus1998
Data processor for invalidating prefetched instruction or branch history informa1997
Substrate for semiconductor apparatus1996
Substrate for semiconductor apparatus1996
Substrate for semiconductor apparatus1995
Microprocessor with pipeline system having exception processing features1994
Lead frame for semiconductor device1992
Substrate for semiconductor apparatus having a composite material1992
Integrated circuit package1989