Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Matched impedance vertical conductors in multilevel dielectric laminated wiring

Matched impedance vertical conductors in multilevel dielectric laminated wiring

US Patent 5157477 · Granted Oct 20, 1992

Estimated economic value: $9,947,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Supersaturation method for producing metal powder with a uniform distribution of1994
Hermetic package for an electronic device1993
Hermetic package for an electronic device and method of manufacturing same1993
Semiconductor chip interposer module with engineering change wiring and distribu1993
Hermetic package for an electronic device and method of manufacturing same1992
Integrated circuit carriers and a method for making engineering changes in said 1992
Method for producing multi-layer ceramic substrates with oxidation resistant met1992
Doped titanate glass-ceramic for grain boundary barrier layer capacitors1989
Forming patterns in metallic or ceramic substrates1985
Electrolytic printing head1985
Chip carrier with embedded engineering change lines with severable periodically 1984
Layered metal film structures for LSI chip carriers adapted for solder bonding a1984