{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Digital computer having an interconnect mechanism stacked above a semiconductor substrate", "item": "https://www.patentleaderboard.com/patent/5148256"}]}
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Home › Digital computer having an interconnect mechanism stacked above a semiconductor substrate

Digital computer having an interconnect mechanism stacked above a semiconductor substrate

US Patent 5148256 · Granted Sep 15, 1992

Estimated economic value: $23,575,000 ⓘ

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