Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Surface mount device with high thermal conductivity

Surface mount device with high thermal conductivity

US Patent 5111277 · Granted May 5, 1992

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for forming hermetic package for a power semiconductor2023
Hermetic package for power semiconductor2021
Surface mount package with ceramic sidewalls2012
Surface mount package with high thermal conductivity2011
Low resistance hermetic lead structure2002
Power semiconductor module2000
Surface mount device with high thermal conductivity1993
Surface mount device with high thermal conductivity1993
Hermetic glass chip carrier1989
Method and apparatus for reducing package height for microcircuit packages1985
Microwave chip carrier1984
Lead grounding1984