MI

Manuel Medeiros, III

AN Aegis Nv: 2 patents #2 of 4Top 50%
MI Microsemi: 2 patents #42 of 169Top 25%
📍 Acushnet, MA: #6 of 51 inventorsTop 15%
🗺 Massachusetts: #20,307 of 88,656 inventorsTop 25%
Overall (All Time): #809,965 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
11721600 Method for forming hermetic package for a power semiconductor Saeed Shafiyan-Rad, David Scott Doiron 2023-08-08
10903128 Hermetic package for power semiconductor Saeed Shafiyan-Rad, David Scott Doiron 2021-01-26
8143717 Surface mount package with ceramic sidewalls 2012-03-27
8080872 Surface mount package with high thermal conductivity 2011-12-20
5188985 Surface mount device with high thermal conductivity Jay S. Greenspan 1993-02-23
5111277 Surface mount device with high thermal conductivity Jay S. Greenspan 1992-05-05