Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721600 | Method for forming hermetic package for a power semiconductor | Saeed Shafiyan-Rad, Manuel Medeiros, III | 2023-08-08 |
| 10903128 | Hermetic package for power semiconductor | Saeed Shafiyan-Rad, Manuel Medeiros, III | 2021-01-26 |
| 7453708 | High reliability module | Weidong Zhuang, Weiping Hu, Michael McGonigle | 2008-11-18 |
| 6078501 | Power semiconductor module | John Catrambone, Jay S. Greenspan, William Leonard Driscoll, Christopher Clarke, Boris Semenov | 2000-06-20 |