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Home › Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators

Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators

US Patent 5015675 · Granted May 14, 1991

Estimated economic value: $11,980,000 ⓘ

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