Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hermetically sealed, surface mountable component and carrier for semiconductor devices

Hermetically sealed, surface mountable component and carrier for semiconductor devices

US Patent 4931906 · Granted Jun 5, 1990

Estimated economic value: $878,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Molded package for semiconductor devices with leadframe locking structure1993
Molded package for semiconductor devices with leadframe locking structure1993