Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5225897 | Molded package for semiconductor devices with leadframe locking structure | Harry C. Reifel, Angelo Santamaria | 1993-07-06 |
| 4931906 | Hermetically sealed, surface mountable component and carrier for semiconductor devices | Harry C. Reifel, Eren Erdag | 1990-06-05 |