Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ohmic contacts and interconnects to silicon and method of making same

Ohmic contacts and interconnects to silicon and method of making same

US Patent 4871617 · Granted Oct 3, 1989

Estimated economic value: $10,849,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for enabling interaction with an electronic device2022
Tapered gate electrode for semiconductor devices2021
System and method for enabling advertisement interaction with an electronic devi2019
Stress resistant micro-via structure for flexible circuits2019
Semiconductor device with junction termination extension2016
Chip attach adhesive to facilitate embedded chip build up and related systems an2013
Interconnect structure2013
SiC MOSFETs and self-aligned fabrication methods thereof2013
Apparatus and method for reducing pitch in an integrated circuit2011
Electronic chip package with reduced contact pad pitch2011
System and method of forming a wafer scale package2011
Method of making an ignition device2010