Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds

Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds

US Patent 4865245 · Granted Sep 12, 1989

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermocompression bonding with passivated gold contacting metal2025
Thermocompression bonding with passivated silver-based contacting metal2025
Thermocompression bonding with passivated tin-based contacting metal2025
Sharps container2025
Sharps container2025
Sharps container2025
Sharps container2025
Thermocompression bonding using metastable gas atoms2025
Thermocompression bonding with passivated copper-based contacting metal2025
Thermocompression bonding with passivated nickel-based contacting metal2025
Container stand2025
Sharps container2025