Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of making three dimensional structures of active and passive semiconductor components

Method of making three dimensional structures of active and passive semiconductor components

US Patent 4737470 · Granted Apr 12, 1988

Estimated economic value: $19,202,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Connector apparatus for subsea blowout preventer2021
Connector apparatus for subsea blowout preventer2019
Connector apparatus for subsea blowout preventer2017
Connector apparatus for subsea blowout preventer2015
Fiber optic gyroscope coil lead dressing and method for forming the same1999
Discretionary gettering of semiconductor circuits1993
Method of fabricating an integrated circuit having active regions near a die edg1993
Method for forming a germanium layer and a heterojunction bipolar transistor1992
Baseboard for orthogonal chip mount1991
Anodizable strain layer for SOI semiconductor structures1991
Baseboard for orthogonal chip mount1990
Silicon-on-insulator integrated circuits and method1989