Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of fabricating a high current package with multi-level leads

Method of fabricating a high current package with multi-level leads

US Patent 4589195 · Granted May 20, 1986

Estimated economic value: $4,721,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for improving the adhesion of a plastic encapsulant to copper containing 1990
Laser markable molding compound1988
Laser markable molding compound, method of use and device therefrom1987
Semiconductor housing1987
Semiconductor device including plateless package fabrication method1986
Method for applying material to a semiconductor wafer1986
Method for encapsulating and marking electronic devices1986
Electrically isolated semiconductor power device1986
Semiconductor device including plateless package1985
High current package with multi-level leads1985
High current package with multi-level leads1985
Electrically isolated semiconductor power device1985