Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4946518 | Method for improving the adhesion of a plastic encapsulant to copper containing leadframes | Dervin L. Flowers | 1990-08-07 |
| 4753863 | Laser markable molding compound | — | 1988-06-28 |
| 4654290 | Laser markable molding compound, method of use and device therefrom | — | 1987-03-31 |
| 4631805 | Semiconductor device including plateless package fabrication method | Dennis R. Olsen | 1986-12-30 |
| 4627988 | Method for applying material to a semiconductor wafer | — | 1986-12-09 |
| 4595647 | Method for encapsulating and marking electronic devices | — | 1986-06-17 |
| 4589195 | Method of fabricating a high current package with multi-level leads | Jerry M. Du Bois | 1986-05-20 |
| 4583283 | Electrically isolated semiconductor power device | Jerry DuBois | 1986-04-22 |
| 4546374 | Semiconductor device including plateless package | Dennis R. Olsen | 1985-10-08 |
| 4518982 | High current package with multi-level leads | Jerry M. Du Bois | 1985-05-21 |
| 4510519 | Electrically isolated semiconductor power device | Jerry DuBois | 1985-04-09 |