Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wire saw

Wire saw

US Patent 4494523 · Granted Jan 22, 1985

Estimated economic value: $5,470,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Gradient chuck method for wafer bonding employing a convex pressure2000
Method of bonding a semiconductor wafer2000
Direct wafer bonded structure method of making1995
Method for single sided polishing of a semiconductor wafer1995
Automated method for joining wafers1994
Method of making dielectric and conductive isolated island1993
Gradient chuck method for wafer bonding employing a convex pressure1992
Wire saw machine1987