Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multilayered glass-ceramic substrate for mounting of semiconductor device

Multilayered glass-ceramic substrate for mounting of semiconductor device

US Patent 4221047 · Granted Sep 9, 1980

Estimated economic value: $41,804,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Embedded semiconductor packages and methods thereof2025
Embedded semiconductor packages and methods thereof2024
Substrate-compatible inductors with magnetic layers2023
Through-package-via (TPV) structures on inorganic interposer and methods for fab2020
Interposer with polymer-filled or polymer-lined optical through-vias in thin gla2016
Through-package-via (TPV) structures on inorganic interposer and methods for fab2016
Interconnect structures and methods of making the same2015
Ultra-thin interposer assemblies with through vias2015
Stress relieving second level interconnect structures and methods of making the 2015
Interconnect assemblies and methods of making and using same2014
Chip-last embedded interconnect structures2013
Embedded actives and discrete passives in a cavity within build-up layers2012