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Home › Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating

Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating

US Patent 4182781 · Granted Jan 8, 1980

Estimated economic value: $10,211,000 ⓘ

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