Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package having semiconductor chip positioned in cavity of cover wiring structure

Semiconductor package having semiconductor chip positioned in cavity of cover wiring structure

US Patent 12512398 · Granted Dec 30, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Breathable, stretchable wader leg, and wader garment with breathable, stretchabl2025
Mobile terminal with low-friction sheets located between housing frames2025
Storage device and operating method of storage device2025
Organic light-emitting device and organometallic compound2025
Cooktop appliance with protected user detection2025
Footwear with cork outsole2025
Organometallic compound and organic light-emitting device including the same2025
Organometallic compound and organic light-emitting device including the same2025
Dishwasher and method for controlling same2025
Semiconductor package2025
Semiconductor package and method of fabricating same2025
Image sensor package2024