Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Manufacturing method of semiconductor device and semiconductor wafer

Manufacturing method of semiconductor device and semiconductor wafer

US Patent 12414345 · Granted Sep 9, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power electronics assembly having vertically stacked transistors2025
Power electronics assembly having staggered and diagonally arranged transistors2024
Cooling assemblies having channels to supply fluid to wick structures2023
Systems including an integrated power module with vias and methods of forming th2023
Power electronics assembly having flipped chip transistors2023
Power electronics assembly having a gate drive device disposed between a plurali2023
High-density integrated power electronic assembly including double-sided cooling2023
Double-sided hybrid cooling of PCB embedded power electronics and capacitors2023
Power electronics systems comprising a two phase cold plate having an outer encl2022
Method of manufacturing semiconductor device2019
Manufacturing method for semiconductor device2016
Method of forming pattern, system for calculating resist coating distribution an2016