Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Arrangement of power-grounds in package structures

Arrangement of power-grounds in package structures

US Patent 12400989 · Granted Aug 26, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package structure, semiconductor device and manufacturing method thereof2025
Package structure, semiconductor device and manufacturing method thereof2025
Metal cut region location method2025
Semiconductor device including parallel configuration2025
Semiconductor device with cell region2025
SOIC chip architecture2025
Integrated circuit package and method2025
Layout design for header cell in 3D integrated circuits2025
Info packages including thermal dissipation blocks2025
Info packages including thermal dissipation blocks2025
Encapsulated package including device dies connected via interconnect die2025
Semiconductor structure and manufacturing method thereof2025