Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit devices including metal lines spaced apart from metal vias, and related fabrication methods

Integrated circuit devices including metal lines spaced apart from metal vias, and related fabrication methods

US Patent 12347774 · Granted Jul 1, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including interconnect structure with metal bridge pattern 2025
Semiconductor device including interconnect structure with metal bridge pattern 2025
Integrated circuit devices including stacked field effect transistors and method2025
Semiconductor device including backside contact structure with silicide layer fo2025
Limited lateral growth of S/D epi by outer dielectric layer in 3-dimensional sta2025
Stacked transistors having an isolation region therebetween and a common gate el2025
Transistor stacks having insulating spacers, and related fabrication methods2025
Three-dimensional stacked semiconductor device including simplified source/drain2025
Integrated circuit devices including a metal resistor and methods of forming the2025
Step-stacked nanowire CMOS structure for low power logic device and method of ma2025
Integrated circuit devices including stacked transistors and methods of forming 2025
Devices including stacked nanosheet transistors2025