Copper alloy bonding wire for semiconductor devices

Assignee

• Nippon Micrometal
• Nippon Steel Chemical

Inventors

• Daizo Oda (44 patents)
• Takashi Yamada (440 patents)
• Motoki ETO (16 patents)
• Teruo Haibara (36 patents)
• Tomohiro Uno (86 patents)

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