Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip chip package assembly having post connects with solder-based joints

Flip chip package assembly having post connects with solder-based joints

US Patent 12288763 · Granted Apr 29, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package with metal column mold barrier2025
Semiconductor die with solder restraining wall2025
Flip-chip package assembly2025
Conductive member cavities2025
Semiconductor device with solder on pillar2024
Conductive members for die attach in flip chip packages2024
Conductive terminal for side facing packages2024
Integral redistribution layer for WCSP2024
Flip chip package assembly2024
Flip chip package assembly2024
IC having electrically isolated warpage prevention structures2024
Semiconductor device with passivated magnetic concentrator2024