Structures and methods for processing a semiconductor substrate

Assignee

• TSMC

Inventors

• Ming-Yi Shen (2 patents)
• Hsin-Lin WU (3 patents)
• Yao-Fong DAI (2 patents)
• Pei-Yuan TAI (1 patents)
• Chin-Wei Chen (7 patents)
• Yin-Tun Chou (12 patents)
• Yuan-Hsin Chi (14 patents)
• Sheng Lin (79 patents)

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