Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package with isolated semiconductor die and electric field curtailment

Semiconductor device package with isolated semiconductor die and electric field curtailment

US Patent 12266595 · Granted Apr 1, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit package for isolation dies2025
Semiconductor fuse with multi-bond wire2025
Integrated magnetic assembly with conductive field plates2024
Integrated high voltage electronic device with high relative permittivity layers2024
Integrated semiconductor device isolation package2024
Semiconductor device and method of the same2024
Isolated temperature sensor package with embedded spacer in dielectric opening2024
High voltage semiconductor device lead frame and method of fabrication2024
Electric field control for bond pads in semiconductor device package2024
Acoustic device package and method of making2023
Semiconductor die with blast shielding2023
Integrated magnetic assembly with conductive field plates2023