{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Double-sided substrate with cavities for direct die-to-die interconnect", "item": "https://www.patentleaderboard.com/patent/12230610"}]}
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Home › Double-sided substrate with cavities for direct die-to-die interconnect

Double-sided substrate with cavities for direct die-to-die interconnect

US Patent 12230610 · Granted Feb 18, 2025

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