Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of forming bottom dielectric isolation layers

Methods of forming bottom dielectric isolation layers

US Patent 12170230 · Granted Dec 17, 2024

Estimated economic value: $116,184,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stress and overlay management for semiconductor processing2025
Three dimensional device formation using early removal of sacrificial heterostru2025
Localized stress modulation by implant to back of wafer2025
Replacement contact process2024
V-NAND stacks with dipole regions2024
Airgap formation processes2023
Airgap formation processes2021
Construction of three-dimensional profiles of high aspect ratio structures using2021
Replacement contact process2021
Construction of three-dimensional profiles of high aspect ratio structures using2020
Overlay control with non-zero offset prediction2019
Apparatus and method for chucking warped wafers2019