Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model

Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model

US Patent 12147741 · Granted Nov 19, 2024

Estimated economic value: $187,157,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hot loadable programmable state machine2025
Air conditioner defrosting control method and device, and non-transitory storage2024
Customizable SoC state reporting2024
LED display device2024
Apparel fitting simulation based upon a captured two-dimensional human body post2023
Backlight module2023
Line edge roughness analysis using atomic force microscopy2023
Light-emitting diode package having bump formed in wriggle shape2023
Systems and methods of simulating drop shock reliability of solder joints with a2023
Systems and methods of simulating drop shock reliability of solder joints with a2023
Systems and methods of simulating drop shock reliability of solder joints with a2023
Systems and methods of simulating drop shock reliability of solder joints with a2023