Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12147741 | Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model | Wei-Shan Hu, Dandan Lyu, Siddharth Shah, Ashutosh Srivastava | 2024-11-19 |
| 11720726 | Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model | Wei-Shan Hu, Dandan Lyu, Siddharth Shah, Ashutosh Srivastava | 2023-08-08 |
| 9817926 | Meshfree method and system for numerically simulating brittle material based on damage mechanics | — | 2017-11-14 |
| 8768660 | Numerically simulating structural behaviors of embedded bi-materials using meshfree method | — | 2014-07-01 |
| 8612186 | Numerical simulation of structural behaviors using a meshfree-enriched finite element method | Wei-Shan Hu | 2013-12-17 |
| 7702490 | Method and system for adaptive mesh-free shell structures | Yong Guo | 2010-04-20 |
| 7660480 | Practical fast mesh-free analysis | Hongsheng Lu | 2010-02-09 |
| 7499050 | Method and system for mesh-free analysis of general three-dimensional shell structures | Yong Guo | 2009-03-03 |
| 7382367 | Method and system for transferring state variables in adaptive mesh-free analysis | Hongsheng Lu | 2008-06-03 |