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Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board

US Patent 12144120 · Granted Nov 12, 2024

Estimated economic value: $28,491,000 ⓘ

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