Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12144120 | Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board | Ryohei KASAI, Tadashi Furukawa, Ryo Furugen, Teppei Sotoda, Tetsushi Hosoda | 2024-11-12 |
| 11566108 | Polyimide film, laminate and surface material for display | Katsuya Sakayori, Koudai Okada, Keisuke WAKITA, Yoshihiro Kobayashi, Aya Takao +3 more | 2023-01-31 |
| 11191164 | Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board | Ryohei KASAI, Tadashi Furukawa, Ryo Furugen, Teppei Sotoda, Tetsushi Hosoda | 2021-11-30 |