Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure and method for manufacturing the same

Package structure and method for manufacturing the same

US Patent 12136579 · Granted Nov 5, 2024

Estimated economic value: $9,507,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package structure and method for manufacturing the same2025
Semiconductor package structure and method for manufacturing the same2024
Semiconductor package structure and method for manufacturing the same2024
Electronic package, optoelectronic package and method of manufacturing the same2023
Package structure and method for manufacturing the same2023
Semiconductor package structure and method for manufacturing the same2023
Semiconductor package including alignment material and method for manufacturing 2022
Semiconductor device package and method of manufacturing the same2022
Semiconductor package structure and method for manufacturing the same2022
Semiconductor device package and method of manufacturing the same2022
Package structure, assembly structure and method for manufacturing the same2022
Interposer between a conductive substrate and plurality of semiconductor compone2022