Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Processing systems and platforms for roughness reduction of materials using illuminated etch solutions

Processing systems and platforms for roughness reduction of materials using illuminated etch solutions

US Patent 12112959 · Granted Oct 8, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods for etching a substrate using a hybrid wet atomic layer etching process2025
Methods for stabilization of self-assembled monolayers (SAMs) using sequentially2025
Methods for stabilization of self-assembled monolayers (SAMs) using sequentially2025
Etching method and etching apparatus2025
Systems for etching a substrate using a hybrid wet atomic layer etching process2025
Methods for selective removal of surface oxides on metal films2025
Selective etching with fluorine, oxygen and noble gas containing plasmas2024
Dynamically adjusted purge timing in wet atomic layer etching2024
Methods for wet atomic layer etching of copper2024
Methods for area-selective deposition of polymer films using sequentially pulsed2023
Methods for area-selective deposition of polymer films using sequentially pulsed2023
Implementing the post-porosity plasma protection (P4) process using I-CVD2022