Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods

Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods

US Patent 12100661 · Granted Sep 24, 2024

Estimated economic value: $58,106,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Encapsulation warpage reduction for semiconductor die assemblies and associated 2025
Thin die release for semiconductor device assembly2025
Thin die release for semiconductor device assembly2025
Perpendicular semiconductor device assemblies and associated methods2025
Perpendicular semiconductor device assemblies and associated methods2025
Microelectronic devices and related methods of fabricating microelectronic devic2025
Microelectronic devices and related methods of fabricating microelectronic devic2025
Apparatuses for handling microelectronic devices2025
Semiconductor device assembly with die support structures2024
Semiconductor devices with recessed pads for die stack interconnections2024
Semiconductor devices with recessed pads for die stack interconnections2024
Semiconductor device assembly with surface-mount die support structures2024