Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure

Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure

US Patent 12098230 · Granted Sep 24, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for optimization of fraud detection model2025
Communication method and communication apparatus2025
Surfactant formulations for aqueous foam stability at high temperature and high 2025
Packaging film and preparation method thereof, and filter chip packaging method2025
Packaging film and preparation method thereof, and filter chip packaging method2025
Packaging film and preparation method thereof, and filter chip packaging method2025
Wafer warpage regulation epoxy functional film, and preparation method and appli2025
Wafer warpage regulation epoxy functional film, and preparation method and appli2025
Wafer warpage regulation epoxy functional film, and preparation method and appli2025
Liquid epoxy molding compound and preparation method thereof2025
Liquid epoxy molding compound and preparation method thereof2025
Liquid epoxy molding compound and preparation method thereof2025