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Packaging film and preparation method thereof, and filter chip packaging method |
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| 12255175 |
Wafer warpage regulation epoxy functional film, and preparation method and application thereof |
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| 12209171 |
Liquid epoxy molding compound and preparation method thereof |
De Wu, Shengquan Wang, Shuhang Liao |
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| 12098230 |
Build-up film with low dielectric loss, preparation method therefor and circuit substrate structure |
De Wu, Yi-Ching Wang, Shuhang Liao |
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| 12037488 |
Liquid molding compound and preparation method thereof |
De Wu, Shengquan Wang, Shuhang Liao |
2024-07-16 |
| 12024591 |
Modification method of polyphenylene ether resin, laminated film composite, laminated film, and substrate |
De Wu, Yi-Ching Wang, Shuhang Liao |
2024-07-02 |
| 11978686 |
Chip protective film and method for manufacturing same, and chip |
De Wu, Shuhang Liao, Liu Zhang |
2024-05-07 |
| 11879076 |
Composition, adhesive film and chip packaging structure |
De Wu, Shuhang Liao, Ting Li |
2024-01-23 |
| 11804463 |
Underfill for chip packaging and chip packaging structure |
De Wu, Shengquan Wang, Yi-Ching Wang, Shuhang Liao |
2023-10-31 |
| 11767450 |
Adhesive, die attach film and preparation method therefor |
De Wu, Shuhang Liao, Ting Li, Yi-Ching Wang |
2023-09-26 |
| 11643499 |
Liquid molding compound for protecting five edges of semiconductor chip and preparation method thereof |
De Wu, Shuhang Liao, Yi-Ching Wang, Shengquan Wang |
2023-05-09 |
| 11286386 |
Circuit build-up film for wafer-level packaging, and fabrication method and use thereof |
De Wu, Shuhang Liao, Yi-Ching Wang, Feifei Liang |
2022-03-29 |