Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High reliability lead-free solder alloys for harsh environment electronics applications

High reliability lead-free solder alloys for harsh environment electronics applications

US Patent 12090579 · Granted Sep 17, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process comprising the use of new iridium catalysts for enantioselective hydroge2025
Spoon handle2025
Systems for PET imaging2025
SnIn solder alloys2025
Voltage conversion circuit, control method, DC/DC converter, and device2025
Data harmonization across multiple sources2024
Converter and on-board charger2024
SnBi and SnIn solder alloys2024
Method and system for calibrating an imaging system2024
Control method for increasing an inverse gain range of a power converter2024
Systems for pet imaging2024
Energy conversion apparatus, power system, and vehicle2023